Mixed Technology
- SMT
- Fine pitch components to 0201, including QFN, BGA, & LGA
- High density component placement
- 100% vision verification for placement
- ENIG, ENEPIG, OSP, IAg, ISn, & HASL Surfaces
- Double sided to 18” x 17” (455mm x 430mm)
- Through-Hole
- High layer count with multiple planes
- Selective wave solder
- Lead-free, RoHS and Tin-lead
- No-Clean or Aqueous cleaning
- ESD compliant facility
- X-Ray and optical inspection
Prototypes
- Quick turn
- Prototype development with circuit and PCB engineering support
- Product incubation
Production
- Low to medium volumes
- System assembly